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Copper plating layer voids on circuit board hole walls
Jun. 21, 2023
PTH is a very important step in the metallization process of printed circuit board holes. Its purpose is to form an extremely thin conductive copper layer on the hole wall and copper surface, preparing for subsequent electroplating. The hole in the hole wall coating is one of the common defects in the metallization of printed circuit boards, and it is also one of the projects that can easily cause batch scrapping of printed circuit boards. Therefore, solving the problem of hole in the printed circuit board coating is a key control for printed circuit board manufacturers. However, due to the diverse reasons for its defects, only by accurately judging the characteristics of its defects can effective solutions be found.
College Students Develop Innovative Flexible Circuit Boards
Jun. 07, 2023
Recently, a technical team from Shenzhen Vocational and Technical College (hereinafter referred to as "Shenzhen Vocational and Technical College") successfully overcame the technical difficulties of stretchable flexible circuits and made positive contributions to stretchable technology in the display field. It is reported that the team is composed of more than ten students from the stretchable flexible circuit board research group of the School of Electronic and Communication Engineering at Shenzhen Vocational College.
OSP Process Explanation
May. 08, 2023
OSP is a process for surface treatment of copper foil on printed circuit boards (PCBs) that meets the RoHS directive requirements. OSP is the abbreviation for Organic Solderability Preservatives. Simply put, OSP is the chemical process of growing an organic film on a clean bare copper surface. This film has oxidation resistance, heat shock resistance and moisture resistance to protect the copper surface from further rusting (oxidation or vulcanization, etc.) in normal environment; However, in the subsequent high welding temperature, this protective film must be easily removed by flux, so that the exposed clean copper surface can be immediately combined with molten solder to form a solid solder joint in a very short time.
The function and process of HASL on circuit boards
Apr. 24, 2023
Tin spraying is the process of soaking a circuit board in molten tin and lead. When sufficient tin and lead are adhered to the surface of the power circuit board, warm air is used to charge and scrape off the excess tin and lead. After tin lead cooling, the area where the circuit board is soldered will be coated with a moderately thin layer of tin lead, which is the rough process of tin spraying manufacturing. The surface treatment technology of PCB is currently commonly used in the tin spraying process, also known as Hot air solder leveling technology, which involves spraying a layer of tin on the solder layer to improve the turn-off characteristics and malleability of the PCB solder layer.
What are the advantages of UVLED curing exposure machines compared to traditional exposure machines
Apr. 07, 2023
UVLED curing exposure machine, as a new type of exposure machine, has received much attention since its inception. UVLED curing exposure machine refers to a device that transfers image information from film or other transparent materials to a surface coated with photosensitive substances by turning on the light. The different precision of image information on film or other transparent materials has different requirements for the light source of the exposure machine. At present, most manufacturers choose to use UVLED curing exposure machines, and the market share of traditional exposure machines has significantly decreased. Why is this? Yuntong Technology will take you to understand the advantages of UVLED curing exposure machines compared to traditional exposure machines.
Surface technology of circuit board: difference between eletroplating gold plate and eletroless gold plate
Mar. 14, 2023
There are several treatment processes for the surface of the circuit board: light board (without any treatment on the surface), rosin board, OSP (organic solder protective agent, slightly better than rosin), tin spraying (with or without lead tin), gold-plated board, gold-plated board, etc. These are more visible.