Copper plating layer voids on circuit board hole walls

PTH is a very important step in the metallization process of printed circuit board holes. Its purpose is to form an extremely thin conductive copper l…
PTH is a very important step in the metallization process of printed circuit board holes. Its purpose is to form an extremely thin conductive copper l…
Recently, a technical team from Shenzhen Vocational and Technical College (hereinafter referred to as "Shenzhen Vocational and Technical College") suc…
OSP is a process for surface treatment of copper foil on printed circuit boards (PCBs) that meets the RoHS directive requirements. OSP is the abbrevia…
Tin spraying is the process of soaking a circuit board in molten tin and lead. When sufficient tin and lead are adhered to the surface of the power ci…
UVLED curing exposure machine, as a new type of exposure machine, has received much attention since its inception. UVLED curing exposure machine refer…
There are several treatment processes for the surface of the circuit board: light board (without any treatment on the surface), rosin board, OSP (orga…