What are the causes of PCB blistering during the copper plating process?
Aug. 08, 2023The reason for PCB surface blistering is actually the problem of poor adhesion of the board surface: PCB blistering is caused by the copper plating pr…
The reason for PCB surface blistering is actually the problem of poor adhesion of the board surface: PCB blistering is caused by the copper plating pr…
The Silkscreen is the topmost layer of a Printed Circuit Board (PCB) which is used as a reference indicator for placing components on a PCB Board. It …
With the rapid development of microelectronics technology, printed circuit board manufacturing is rapidly developing towards multi-layer, integrated, …
PTH is a very important step in the metallization process of printed circuit board holes. Its purpose is to form an extremely thin conductive copper l…
Recently, a technical team from Shenzhen Vocational and Technical College (hereinafter referred to as "Shenzhen Vocational and Technical College") suc…
OSP is a process for surface treatment of copper foil on printed circuit boards (PCBs) that meets the RoHS directive requirements. OSP is the abbrevia…