OSP Process Explanation
May. 08, 2023
OSP is a process for surface treatment of copper foil on printed circuit boards (PCBs) that meets the RoHS directive requirements. OSP is the abbrevia…
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May. 08, 2023
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The function and process of HASL on circuit boards
Apr. 24, 2023
Tin spraying is the process of soaking a circuit board in molten tin and lead. When sufficient tin and lead are adhered to the surface of the power ci…
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What are the advantages of UVLED curing exposure machines compared to traditional exposure machines
Apr. 07, 2023
UVLED curing exposure machine, as a new type of exposure machine, has received much attention since its inception. UVLED curing exposure machine refer…
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Surface technology of circuit board: difference between eletroplating gold plate and eletroless gold plate
Mar. 14, 2023
There are several treatment processes for the surface of the circuit board: light board (without any treatment on the surface), rosin board, OSP (orga…
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Introduction of common PCB microporous technology
Mar. 01, 2023
With the improvement of product performance, the PCB is also constantly updated and developed. The circuit is becoming more and more dense, and more a…
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PCB hole copper plated cavity Occurrence and Countermeasures
Jan. 04, 2023
PTH is a very important step in the hole metallization process of PCB circuit board. Its purpose is to form an extremely thin conductive copper layer …
