OSP Process Explanation

OSP is a process for surface treatment of copper foil on printed circuit boards (PCBs) that meets the RoHS directive requirements. OSP is the abbrevia…
OSP is a process for surface treatment of copper foil on printed circuit boards (PCBs) that meets the RoHS directive requirements. OSP is the abbrevia…
Tin spraying is the process of soaking a circuit board in molten tin and lead. When sufficient tin and lead are adhered to the surface of the power ci…
UVLED curing exposure machine, as a new type of exposure machine, has received much attention since its inception. UVLED curing exposure machine refer…
There are several treatment processes for the surface of the circuit board: light board (without any treatment on the surface), rosin board, OSP (orga…
With the improvement of product performance, the PCB is also constantly updated and developed. The circuit is becoming more and more dense, and more a…
PTH is a very important step in the hole metallization process of PCB circuit board. Its purpose is to form an extremely thin conductive copper layer …