PCB板微孔加工方法
Sep. 02, 2022
随着电子产品的快速更新，PCB印刷已经从单层板扩展到双层板和对高精度有更复杂要求的多层板。因此，对电路板孔的加工要求越来越高，例如孔径越小，孔之间的间距越小。据了解，环氧树脂基复合材料广泛应用于板材厂。孔的尺寸定义为直径小于0.6mm的小孔和直径小于0.3mm的微孔。
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Sep. 02, 2022
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PCB蚀刻工艺及工艺控制
Aug. 04, 2022
The process of printed circuit board from optical board to displaying circuit pattern is a relatively complex physical and chemical reaction process. This paper analyzes the last step - etching. At present, the typical process of printed circuit board (PCB) processing is "pattern plating". That is, a layer of lead tin anti-corrosion layer is pre plated on the copper foil part to be retained on the outer layer of the board, that is, the graphic part of the circuit, and then the rest of the copper foil is chemically corroded, which is called etching.
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如何提高印刷电路板PCB的镀金厚度？
Jul. 21, 2022
Introduction Gold is a yellow precious metal, which has excellent ductility and plasticityand is easy topolish. Gold is chemically stable and insoluble in general acids and bases. With gold as the coating, it has not only good corrosion resistance, but also strong conductivity, high temperature resistance, easy welding, and excellent discoloration resistance. There are many problems in the general thick gold plating process, such as dry film infiltration, rough coating lines, uneven thickness and other phenomena. The gold thickness is not enough to meet some special needs of Aerospace Military printed boards. Many requirements of the gold thickness of some Aerospace Military printed boards meet the category of ultra thick gold. Therefore, it is imperative to research and develop super thick gold plating process and improve the thickness of gold plating.
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UV LED曝光机的优点
Jul. 19, 2022
UV LED曝光机采用平行光源，发射365nm/395nm单波段光源，无杂波能耗，能量均匀性可达95%，适用于精密电路行业。
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甲状旁腺素的质量控制方法
Jul. 19, 2022
化学镀铜通常被称为铜沉积。印刷电路板的孔金属化技术是印刷电路板制造技术的关键之一。严格控制孔金属化的质量是保证最终产品质量的前提，而控制铜沉积层的质量是关键。日常试验控制方法如下：
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电流密度对电镀质量的影响
Jul. 14, 2022
对于某种镀液，允许的电流密度通常存在于上下限的范围内。如果超过这个范围，获得的涂层质量往往不合格。一般来说，我们总是希望允许更宽范围的电流密度。
