PCB Board Micro Hole Processing Method

With the rapid update of electronic products, PCB Printing has expanded from single-layer boards to double-layer boards and multi-layer boards with more complex requirements for high accuracy. Therefore, there are more and more requirements for the processing of circuit board holes, such as the smaller the hole diameter and the smaller the spacing between holes. It is understood that epoxy resin based composites are widely used in plate factories. The size of holes is defined as small holes with a diameter of less than 0.6mm and micropores with a diameter of less than 0.3mm.