Mar. 01, 2023
With the improvement of product performance, the PCB is also constantly updated and developed. The circuit is becoming more and more dense, and more and more components need to be placed. However, the size of the PCB will not become larger, but will become smaller and smaller. At this time, it requires considerable technology to drill holes on the plate.
Jan. 04, 2023
PTH is a very important step in the hole metallization process of PCB circuit board. Its purpose is to form an extremely thin conductive copper layer on the hole wall and copper surface to prepare for subsequent electroplating. The hole in the hole wall coating is one of the common defects in PCB hole metallization, and also one of the items that are easy to cause batch scrapping of printed circuit boards. Therefore, solving the problem of hole in the coating of printed circuit boards is a key control item for printed circuit board manufacturers. However, because there are many reasons for its defects, only by accurately judging the characteristics of its defects can we effectively find a solution.
Dec. 27, 2022
How to distinguish HDI PCB Primary pressing, Twice pressing and Triple pressing HDI board (High Density Interconnector), namely high-density interconnection board, is a circuit board with High circuit distribution Density using micro blind hole embedding technology. The HDI board has an inner layer circuit and an outer layer circuit, and then uses drilling, hole metallization and other processes to connect the internal circuits of each layer.
Dec. 20, 2022
Electroplated copper layer has the advantages of good conductivity, thermal conductivity and mechanical ductility, and is one of the indispensable key electroplating technologies in the manufacture of printed circuit board (PCB). Copper plating for printed circuit board includes Panel plating, graphic circuit copper plating and microporous fabrication copper plating. The commonly used plating solutions include sulfate plating solution, pyrophosphate direct plating solution and cyanide plating solution. At present, acid sulfate plating solution is commonly used.
Nov. 11, 2022
At present, printed circuit board is still the main assembly mode of electronic equipment used for various electronic equipment and systems. Practice has proved that even if the circuit schematic is correctly designed and the printed circuit board is improperly designed, the reliability of electronic equipment will be adversely affected. For example, if two thin parallel lines of the printed board are close together, the delay of the signal waveform will be formed and the reflected noise will be formed at the end of the transmission line. Therefore, when designing the printed circuit board, we should pay attention to the correct method.
Nov. 01, 2022
In the production process of printed circuit board, there are two kinds of main electroplating equipment, one is horizontal electroplating line, the other is vertical electroplating line. The two different structures of electroplating equipment, mainly the delivery of the circuit board is different, the conveyor board equipment structure is not the same, so the maintenance is also slightly different.
