Sep. 01, 2023
The key to horizontal electroplating is to create a suitable horizontal electroplating system that can enable highly dispersed plating solutions to exhibit superior functional effects compared to vertical electroplating methods through improved power supply and other auxiliary devices.
Aug. 21, 2023
The phrase “everything is made in China” has become a familiar refrain across the global hardware industry. In light of the pandemic and trade wars of the past few years, businesses have had to grapple with the challenge of finding new ways to manufacture electronics without relying on China. In this article, we will explore the components that are typically sourced from China and provide strategies for businesses to reduce their dependence on Chinese imports without significantly increasing device costs.
Aug. 14, 2023
In the era of “Industry 4.0”, the overall technology upgrade of the domestic PCB industry chain has triggered the resonance of the industry, which is stirring up a round of “spring breeze” upsurge in the development of China’s circuit board equipment.
Aug. 08, 2023
The reason for PCB surface blistering is actually the problem of poor adhesion of the board surface: PCB blistering is caused by the copper plating process in the production process of circuit boards, and is also one of the common quality defects. Due to the complexity of circuit board production process and process maintenance, especially in the chemical wet treatment process, it is difficult to prevent surface blistering defects. The reason for PCB surface blistering is actually the problem of poor adhesion, which can also be said to be a surface quality issue of the board surface;
Aug. 07, 2023
The Silkscreen is the topmost layer of a Printed Circuit Board (PCB) which is used as a reference indicator for placing components on a PCB Board. It requires a specifically formulated ink whose standard color is white, but it can also be Red, Black, Yellow, Blue and a number of other colors.
Jul. 27, 2023
With the rapid development of microelectronics technology, printed circuit board manufacturing is rapidly developing towards multi-layer, integrated, functional, and integrated directions. The concept and design of circuit graphics using a large number of small holes, narrow spacing, and fine wires in printed circuit design have made the manufacturing technology of printed circuit boards more difficult, especially when the aspect ratio of through holes in multi-layer boards exceeds 5:1 and deep blind holes are widely used in laminated boards, making the conventional vertical electroplating process unable to meet the technical requirements of high-quality and high reliability interconnection holes. The main reason for this is to analyze the current distribution status based on the electroplating principle.
