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PCB Copper Plating Line

Principle of AOI detection equipment
Jun. 17, 2022
AOI testing equipment, also known as AOI optical automatic testing equipment, has become an important testing tool and process quality control tool to ensure product quality in the electronic manufacturing industry. Therefore, how to select and use AOI optical automatic testing equipment suitable for their own requirements from a large number of AOI brands has become a problem of great concern to the majority of electronic manufacturing workers.
Work principle and process of PCB laser photoplotter
Jun. 15, 2022
Laser photoplotter, referred to as photoplotter, is a phototypesetting product integrating laser optical technology, microelectronic technology and ultra-precision machinery. It is used to draw various graphics, images, text or symbols on photosensitive film.
Etching process in PCB processing
Jun. 09, 2022
The process of printed circuit board from optical board to showing circuit pattern is a complex physical and chemical reaction process. This paper analyzes the last step - etching. At present, the typical process of printed circuit board (PCB) processing is "graphic electroplating". That is, a layer of lead tin anti-corrosion layer is pre plated on the copper foil to be retained on the outer layer of the board, that is, the graphic part of the circuit, and then the rest of the copper foil is chemically corroded, which is called etching.
About drilling in PCB production
Jun. 08, 2022
Most holes, including NPTH and PTH holes, will be drilled on the pressed plate during initial drilling. When drilling PTH hole, the diameter of the hole shall be compensated under the original size required by the customer, considering that the hole diameter will be reduced during copper deposition and electroplating.
What is HASL? What is the difference between lead-free HASL and lead tin HASL?
Jun. 02, 2022
The surface treatment of PCB striking board includes OSP, gold precipitation, bare copper, Hard zinc plating, and the most common HASL. HASL can be divided into lead-free HASL and lead HASL. These surface treatments can be done by deep sub electrons.
What's PCB layer bonding and its process ？
May. 31, 2022
In the manufacture of PCB, the lamination process usually refers to the lamination of copper foil, prepreg and the core board (inner layer) with a prepared circuit in a certain order, and then through a press, first hot pressing, under high temperature and high pressure conditions. , fuse it into one, and then cold-press to release the stress and ensure the product is flat.