Jul. 11, 2022
There are four special plating methods in the production of circuit boards, which are row plating equipment, through-hole plating, roller linked selective plating and brush plating. This paper introduces these four special methods in detail.
Jul. 05, 2022
Black hole is one of the direct electroplating technologies. Its main principle is to use the physical principle to make the carbon powder adsorb on the hole wall surface to form a conductive layer, which can be used as the conductive lead for subsequent copper electroplating.
Jul. 04, 2022
PCB electroplating process flow: Pickling → copper plating on the whole board → pattern transfer → acid degreasing → 2 levels countercurrent rinsing → micro etching → 2 levels water rinsing → pickling → tin plating → 2 levels countercurrent rinsing Countercurrent rinsing → pickling → graphic copper plating → 2 levels countercurrent rinsing → nickel plating → 2 levels water rinsing → citric acid pickling → gold plating → recycling → 2-3 levels of pure water washing → drying
Jun. 30, 2022
The hole metallization technology is not complicated, and can be simply divided into two parts: preparation before copper plating and copper plating. The quality of copper electroplating depends on the preparation before copper electroplating to a large extent.
Jun. 27, 2022
The purpose of pattern electroplating is to increase the thickness of lines and holes (mainly the thickness of hole copper) to ensure its conductivity and other properties.
Jun. 21, 2022
The activator is a low-hydrochloric acid type catalyst liquid, which can provide the required palladium ions on the surface of the board and in the holes, which can supply high uniform operation efficiency without causing the multi-layer board to produce holes.
