The main manufacturing difficulties of high-level circuit board
Dec. 30, 2021
The research literature on high-level circuit board processing technology is relatively few in the industry.This paper introduces the key process control points of key production processes such as material selection, laminated structure design, interlayer alignment, inner circuit fabrication, lamination process and drilling process, so as to provide peer reference and understanding, and hope more peers to participate in the technical research and communication of high-level circuit boards.