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HOT PRODUCTS

  • PCB Copper Plating Line

    PCB Copper Plating Line

  • What are the reasons for PCB board warping and how to prevent it?

    What are the reasons for PCB board warping and how to prevent it?

    Jan. 14, 2022

    PCB board after reflow welding is prone to board bending and board warping, serious cases will even cause components empty welding, monument erection and other situations, how to overcome?

  • Function and thickness of copper clad on PCB

    Function and thickness of copper clad on PCB

    Jan. 12, 2022

    Copper clad on PCB can play a certain role in reflow. Of course, if there are many layers and the layer setting is reasonable, the role of copper clad reflow is very small;

  • Types of PCB holes

    Types of PCB holes

    Jan. 10, 2022

    Are all the edge holes of PCB production boards used for positioning? Not all. There is also a row of holes arranged from small to large, called the first hole, which is used for detection.

  • 7 inspection methods in PCB fabrication

    7 inspection methods in PCB fabrication

    Jan. 04, 2022

    In order to ensure the production quality of PCB board, the manufacturer has experienced a variety of inspection methods in the production process, and each inspection method is aimed at different PCB board defects.

  • What factors should be considered when purchasing flying probe tester ?

    What factors should be considered when purchasing flying probe tester ?

    Dec. 31, 2021

    The flying probe tester for testing PCB is an instrument for testing PCB boards (printed circuit boards) with high-density component layout, many layers, large wiring density and small distance between measuring points.

  • The main manufacturing difficulties of high-level circuit board

    The main manufacturing difficulties of high-level circuit board

    Dec. 30, 2021

    The research literature on high-level circuit board processing technology is relatively few in the industry.This paper introduces the key process control points of key production processes such as material selection, laminated structure design, interlayer alignment, inner circuit fabrication, lamination process and drilling process, so as to provide peer reference and understanding, and hope more peers to participate in the technical research and communication of high-level circuit boards.

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