The electroplating of metallized holes is a very important part in PCB manufacturing. If the electroplating is not good, the following aspects will be affected:

I, Uniformity of hole wall copper thickness

The hole wall copper is divided into several points, porthole, innerside & porthole of other side. If the hole copper is uneven, it will affect the increase of hole resistivity, thus affecting the conductivity of metallized holes. The best copper plating quality of hole wall requires that the thickness of the copper in the hole is uniform, and the thickness should be greater than 18um, and military products will have good conductivity if the thickness is greater than 25um.

II, If the aspect ratio is large, there will be no copper in the hole

When making aspect ratio for holes (ratio of plate thickness to hole diameter) greater than 6:1, the solution entering ability is very poor. At this time, in order to complete the electroplating of good metallized holes, in addition to the electroplating solution, the equipment plays a vital role. If the electroplating solution cannot enter the hole without the help of the equipment, there will be no copper in the hole, thus affecting the conduction of metallization.

III, Uneven copper plating will affect the accuracy of the circuit

When we produce PCB boards, we usually make a relatively large working plate, which is cut and then turned into a small board later. Therefore, when making large plates, once the copper plating is uneven, it will affect the fineness of circuit corrosion. The circuit with thin copper plating have been corroded well by etching solution, while the circuit with thick copper plating have not been corroded well. If the places with thick copper plating are etching again, the places with thin coating have been corroded too much, then this board means that it is a waste, so the electroplating uniformity is a very important part affecting the circuit fineness.

To sum up, in order to deal with the quality problems caused by appeal factors, the following functions are required in the configuration of electroplating line:

1.Good swing to fully ensure that the solution can pass through the hole.

2.Good air pumping and stirring means that the solution is fully stirred and has good activity to ensure the uniformity of copper plating.

3.Excellent control system to fully ensure that the temperature of the solution is within the process range.

4.Reliable electric vibrationand gas roof system ensure that there is no problem of solution penetration due to bubble blockage in the hole.

5.Excellent filtration system ensures that the solution is free of impurities, so as to ensure that there is no copper slag on the copper plating surface.

6.The cooling water function of cathode seat ensures the good conductivity of flying barand flying bar seat, so as to obtain good electroplating conditions.

7.The sinking titanium clad copper anode rod fully solves the problem of the combination of titanium blue and anode rod, so as to ensure effective anode connection.

8.The liquid level sensor ensures the alarm function of low liquid level and high liquid level, so as to ensure that the plate is fully plated in the liquid.

9.Accurate time controllerensures the accurate working time of the electroplating plate in the solution, so as to ensure the thickness of copper plating.

10.Stable and reliable electroplating power supply fully ensures the current and voltage required for electroplating, so as to ensure the quality of electroplating products.

11.The side exhaust system will extract and filter the gas volatilized from the electroplating solution, so as to ensure the electroplating environmen