Analysis of Film Deformation in PCB Process

1、 Causes and solutions of negative film deformation: Reason: (1) Temperature and humidity control failure (2) The temperature rise of the exposure ma…
1、 Causes and solutions of negative film deformation: Reason: (1) Temperature and humidity control failure (2) The temperature rise of the exposure ma…
The purpose of etching is to etch the unprotected non-conductive part of copper on the printed circuit board with patterns made in the previous proces…
Huawei Mate 50 series has been officially put on sale, "sold out in seconds", in the first sale process, there is no doubt that the reproduction of "o…
Core tip: Many customers think that the film temperature and pressure should be increased to enhance the adhesion after the hole is broken in the dry …
Screen printing refers to the screen printing plate with pictures and texts made by using the screen as the plate base and using the photosensitive pl…
What is the difference between gold plating and silver plating on PCB? The PCB used in the wide variety of board products in the market is a dazzling …