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Technical

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  • Introduction of common ceramic substrate PCB board

    April. 16, 2021

    Ceramic substrate refers to a special process plate in which at a very high temperature copper foil is directly bonded to the surface(single sided or double sided) of Al2O3 or AlN ceramic substrate. The ultra-thin composite substrate made has excellent electrical insulation properties, high thermal conductivity, excellent solderability and high adhesion strength, and can be etched into various patterns like a PCB board, and has a large current carrying ability. Therefore, ceramic substrates have become the basic material for high-power power electronic circuit structure technology and interconnection technology.

  • Electroplating production line and technical process management

    March. 26, 2021

    Electroplating process management is an important link during production. It is determined by electroplating workers after millions of times of trial and research. So electroplating process has a strong scientificity. The determination of the process should not only take into deposition rate of coating, current efficiency of anode and cathode, the dissolution of metal ions and depositional balance, but also consider stability of PH value, temperature, broadness of current density, rate of bright dipping, leveling performance, light range and other factors. Therefore, we must pay attention to all specified technical specifications. On this basis a good coating can be plated. Regarding how to strengthen the management of the electroplating process, we put forward the following views:

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